QuestionFebruary 10, 2026

QUESTION: Which statement is true about the effects of ambient temperature on solid state devices? POSSIBLE ANSWERS: A solid state device is more likely to withstand excessive cold than excessive heat. The typical failure rate for a solid state device is 35^circ C(95^circ F) The failure rate for a solid state device doubles for every 10^circ C that the temperature rises.

QUESTION: Which statement is true about the effects of ambient temperature on solid state devices? POSSIBLE ANSWERS: A solid state device is more likely to withstand excessive cold than excessive heat. The typical failure rate for a solid state device is 35^circ C(95^circ F) The failure rate for a solid state device doubles for every 10^circ C that the temperature rises.
QUESTION:
Which statement is true about the effects of ambient temperature on solid state devices?
POSSIBLE ANSWERS:
A solid state device is more likely to withstand excessive cold than excessive heat.
The typical failure rate for a solid state device is 35^circ C(95^circ F)
The failure rate for a solid state device doubles for every 10^circ C that the temperature rises.

Solution
4.6(353 votes)

Answer

The failure rate for a solid state device doubles for every 10^{\circ }C that the temperature rises. Explanation 1. Identify the correct statement about temperature effects Cold generally causes less damage to solid-state devices than excessive heat, and higher temperatures accelerate failure rates. The well-known reliability rule for electronics states that failure rate approximately doubles for every 10^{\circ}\text{C} rise in temperature. 2. Choose from the options The statement "The failure rate for a solid state device doubles for every 10^{\circ }C that the temperature rises" is true and aligns with electronic reliability principles.

Explanation

1. Identify the correct statement about temperature effects <br /> Cold generally causes less damage to solid-state devices than excessive heat, and higher temperatures accelerate failure rates. The well-known reliability rule for electronics states that failure rate approximately doubles for every $10^{\circ}\text{C}$ rise in temperature. <br />2. Choose from the options <br /> The statement "The failure rate for a solid state device doubles for every $10^{\circ }C$ that the temperature rises" is true and aligns with electronic reliability principles.
Click to rate:

Similar Questions